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ADG1611/ADG1612/ADG1613
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Table 6.
VDD to VSSV VDD to GND 0.3 V to +18 V VSS to GND +0.3 V to 18 V Analog Inputs1 VSS 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
1
Digital Inputs GND 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D 630 mA (pulsed at 1 ms,
10% duty-cycle maximum)
Continuous Current, S or D2 Data + 15% Operating Temperature Range Industrial (Y Version) 40°C to +125°C Storage Temperature Range 65°C to +150°C Junction Temperature 150°C
150.4°C/W 16-Lead TSSOP, θJA Thermal
Impedance (2-Layer Board)
48.7°C/W 16-Lead LFCSP, θJA Thermal
Impedance (4-Layer Board)
260°C Reflow Soldering Peak
Temperature, Pb free
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be limited to the maximum ratings given. 2
See Table 5.
1
ESD CAUTION
Rev. A | Page 8 of 16
