繁星点点数字模拟开关
ADG1611/ADG1612/ADG1613
OUTLINE DIMENSIONS
0.150.05
COPLANARITY
0.10
1.20COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 34. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
0.500.40FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TOTHE PIN CONFIGURATION ANDFUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1.000.850.80COMPLIANTTOJEDEC STANDARDS MO-220-VGGC.
031006-A
0.18
COPLANARITY
0.08
Figure 35. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-16-13)
Dimensions shown in millimeters
ORDERING GUIDE
Package Description
1
ADG1611BRUZ 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1611BRUZ-REEL 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1611BRUZ-REEL7 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1611BCPZ-REEL 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1611BCPZ-REEL7 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1612BRUZ-REEL 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] ADG1612BRUZ-REEL71 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1612BCPZ- REEL 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1612BCPZ-REEL7 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1613BRUZ-REEL 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1613BRUZ-REEL7 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] ADG1613BCPZ-REEL1 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1613BCPZ-REEL7 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
Package Option
RU-16 RU-16 RU-16 CP-16-13CP-16-13RU-16 RU-16 CP-16-13CP-16-13RU-16 RU-16 CP-16-13CP-16-13
Z = RoHS Compliant Part.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07981-0-9/09(A)
Rev. A | Page 16 of 16
