IC封装 报告 - 图文

CLCC CNR Communication and Networking Riser Specification Revision 1.2 SOJ 32L SOJ SOP EIAJ TYPE II 14L CPGA Ceramic Pin Grid Array DIP Dual Inline Package SOT220 SSOP 16L SSOP DIP-tab Dual Inline Package with TO18 Metal Heatsink FBGA TO220 FDIP TO247 FTO220 TO264 Flat Pack TO3 HSOP28 TO5 ITO220 TO52 TO71 ITO3p TO72 JLCC LCC TO78 LDCC TO8 LGA TO92 LQFP TO93 PCDIP PGA Plastic Pin Grid Array TO99 TSOP Thin Small Outline Package PLCC 详细规格 TSSOP or TSOP II Thin Shrink PQFP Outline Package PSDIP Grid Array uBGA Micro Ball LQFP 100L 详细规格 METAL QUAD 100L 详细规格 uBGA Micro Ball Grid Array ZIP PQFP 100L 详细规格 QFP Quad Flat Package CERQUAD Ceramic Quad Flat Pack SOT223 详细规格 Ceramic Case SOT223 LAMINATE CSP 112L Chip Scale Package SOT23 详细规格 C-Bend Lead TEPBGA 288L TEPBGA Zig-Zag Inline Package SOT220