loadingIPC标准清No.1234567891011121314英文名称IPC-T-50G Terms and Definition for Interconnecting and PackagingElectronic CircuitsIPC-TM-650 Test Methods ManualIPC/EIA J-STD-001C Requirements for Soldered Electrical &Electronic AssembliesIPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1IPC-A-610D Acceptability of Electronic AssembliesIPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-EA-100-K Electronic Assembly Reference SetIPC/WHMA-A-620 Requirements and Acceptance for Cable and WireHarness AssembliesIPC/EIA J-STD-012 Implementation of Flip Chip and Chip ScaleTechnologyIPC-SM-784 Guidelines for Chip-on-Board Technology ImplementationIPC/EIA J-STD-026 Semiconductor Design Standard for Flip ChipApplicationsJ-STD-027 Mechanical Outline Standard for Flip Chip and Chip SizeConfigurationsIPC/EIA J-STD-028 Performance Standard for Construction of FlipChip and Chip Scale BumpsJ-STD-013 Implementation of Ball Grid Array and Other High DensityTechnology15IPC-7095 Design and Assembly Process Implementation for BGAs16IPC/EIA J-STD-032 Performance Standard for Ball Grid Array Balls17IPC-MC-790 Guidelines for Multichip Module Technology Utilization18IPC-M-108 Cleaning Guides and Handbook Manual19IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards20IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: WhatDoes It Tell Us?21IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies22IPC-SC-60A Post Solder Solvent Cleaning Handbook23IPC-SA-61A Post Solder Semi-aqueous Cleaning Handbook24IPC-AC-62A Aqueous Post Solder Cleaning Handbook25IPC-TR-476A Electrochemical Migration: Electrically Induced Failuresin Printed Circuit Assemblies26IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air27IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing28IPC-9201 Surface Insulation Resistance Handbook29IPC-TP-104-K Cleaning & Cleanliness Test Program, Phase 3 WaterSoluble Fluxes,30IPC-M-109 Component Handling ManualIPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification forNonhermetic Solid State Surface Mount DevicesIPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of32Moisture/Reflow Sensitive Surface Mount DevicesIPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic33Encapsulated Electronic Components3134IPC-DRM-18G Component Identification Desk Reference Manual3536373839IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation DeskReference ManualIPC-DRM-40E Through-Hole Solder Joint Evaluation Desk ReferenceManualIPC-DRM-56 Wire Preparation & Crimping Desk Reference ManualIPC-DRM-53 Introduction to Electronics Assembly Desk ReferenceManualIPC-M-103 Standards for Surface Mount Assemblies Manual40IPC-M-104 Standards for Printed Board Assembly Manual41IPC-TA-722 Technology Assessment of Soldering42IPC-TA-723 Technology Assessment Handbook on Surface Mounting43IPC-TA-724 Technology Assessment Series on Clean RoomsIPC-SM-780 Component Packaging and Interconnecting withEmphasis on Surface MountingIPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface45Mount AttachmentsIPC-9701 Performance Test Methods and Qualification Requirements46for Surface Mount Solder AttachmentsIPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level47Interconnects4448IPC-PD-335 Electronic Packaging Handbook49IPC-7525 Stencil Design GuidelinesIPC-QL 365A Certification of Facilities That Inspect/Test PrintedBoards, Components and MaterialsIPC-9191 General Guidelines for Implementation of Statistical Process51Control52IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study5053IPC-MI-660 Incoming Inspection of Raw Materials ManualIPC/EIA J-STD-004A Requirements for Soldering Fluxes-IncludesAmendment 1IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes55Amendment 15456IPC-HDBK-005 Guide to Solder Paste AssessmentIPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloysand Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求IPC-SM-817 General Requirements for Dielectric Surface MountingAdhesivesELEC-SOLDER Modern Solder Technology for Competitive ElectronicsManufacturingIPC-WP-006 Round Robin Testing & Analysis: Lead-Free Alloys-Tin,Silver, & CopperIPC-CA-821 General Requirements for Thermally ConductiveAdhesivesIPC-3406 Guidelines for Electrically Conductive Surface MountAdhesivesIPC-3408 General Requirements for Anisotropically ConductiveAdhesives FilmsIPC-CC-830B Qualification and Performance of Electrical InsulatingCompound for Printed Wiring AssembliesIPC-HDBK-830 Guideline for Design, Selection and Application ofConformal CoatingsIPC-SM-840C Qualification and Performance of Permanent SolderMask - Includes Amendment 15758596061626364656667IPC-HDBK-840 Guide to Solder Paste AssessmentELEC-MICRO Handbook of Lead Free Solder Technology forMicroelectronic AssembliesIPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-690016870IPC-AJ-820 Assembly & Joining Handbook71IPC-7530 Guidelines for Temperature Profiling for Mass Soldering(Reflow & Wave) Processes72IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes73IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean ProcessIPC-TR-460A Trouble-Shooting Checklist for Wave Soldering PrintedWiring Boards74IPC-S-816 SMT Process Guideline & Checklist7576IPC-CM-770E Component Mounting Guidelines for Printed Boards77IPC-7912A Calculation of DPMO & Manufacturing Indices for PrintedBoard Assemblies78IPC-9261 In-Process DPMO and Estimated Yield for PWAs79IPC-DPMO-202 IPC-7912/9261 End Item and In Process DPMO SetIPC-9500-K Assembly Process Component Simulations, Guidelines &Classifications PackageIPC-9501 PWB Assembly Process Simulation for Evaluation of81Electronic ComponentsIPC-9502 PWB Assembly Soldering Process Guideline for Electronic82Components8083IPC-9503 Moisture Sensitivity Classification for Non-IC Components84IPC-9504 Assembly Process Simulation for Evaluation of Non-ICComponents (Preconditioning Non-IC Components)85IPC-9850-K Surface Mount Placement Equipment Characterization-KIT8687888990919293IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for SurfaceMount Placement Equipment Standardization? 4 IPC-9850 Placement Accuracy Verification Panels? 1 IPC-9850 CMM Measurement Verification Panels? 150 IPC-9850 QFP-100 Glass Components? 130 IPC-9850 QFP-208 Glass Components? 150 IPC-9850 BGA-228 Glass Components? NIST Traceable Measurement Certificate? Custom Storage CaseIPC/EIA J-STD-002B Solderability Tests for Component Leads,Terminations, Lugs, Terminals and Wires94IPC-7711/21A9596IPC/EIA J-STD-003A Solderability Tests for Printed BoardsIPC-TR-461 Trouble-Shooting Checklist for Wave Soldering PrintedWiring BoardsIPC-TR-462 Solderability Evaluation of Printed Boards with Protective98Coatings Over Long-term Storage9799IPC-TR-464 Accelerated Aging for Solderability EvaluationsIPC-TR-465-1 Round Robin Test on Steam Ager Temperature ControlStabilityIPC-TR-465-2 The Effect of Steam Aging Time and Temperature on101Solderability Test ResultsIPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes,102Phase IIAIPC-TR-466 Technical Report: Wetting Balance Standard Weight103Comparison Test100104SMC-WP-001 Soldering Capability White Paper Report105SMC-WP-005 PCB Surface Finishes IPC:Association Connecting Electronics Industries(电子制造协会),
Institute of the Interconnecting and Packing Electronic Circuit”(电子电路互连与封装协会)逐步发展
标准清单中文名称电子电路互连与封装的定义和术语试验方法手册电气与电子组装件锡焊要求J-STD-001辅助手册及指南及修改说明1印制板组装件验收条件IPC-610手册和指南(包括IPC-A-610B和C的对比)电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。电缆和引线贴装的要求和验收倒装芯片及芯片级封装技术的应用芯片直装技术实施导则倒装芯片用半导体设计标准FC（倒装片）和CSP(芯片级封装)的外形轮廓标准倒装芯片及芯片级凸块结构的性能标准球栅阵列 (BGA)及其它高密度封装技术的应用球栅阵列的设计与组装过程的实施BGA球形凸点的标准规范多芯片组件技术应用导则清洗导则和手册非密集型印制板清洁应用导则电路板离子洁净度测量：它告诉我们什么？印制板及组装件清洗导则锡焊后溶剂清洗手册锡焊后半水溶剂清洗手册锡焊后水溶液清洗手册电化学迁移：印制电路组件的电气诱发故障