loading\\
+flush printed board \\ 齐平印制板 \\
+metal core printed board \\ 金属芯印制板 \\
+metal base printed board \\ 金属基印制板 \\
+mulit-wiring printed board \\ 多重布线印制板 \\
+ceramic substrate printed board \\ 陶瓷印制板 \\
+electroconductive paste printed board \\ 导电胶印制板 \\
+molded circuit board
\\ 模塑电路板 \\
+stamped printed wiring board \\ 模压印制板 \\
+sequentially-laminated multilayer \\ 顺序层压多层印制板 \\
+discrete wiring board \\ 散线印制板 \\
+micro wire board \\ 微线印制板 \\
+buile-up printed board
\\ 积层印制板 \\
+build-up mulitlayer printed board (bum) \\ 积层多层印制板 \\
+build-up flexible printed board \\ 积层挠印制板 \\
+surface laminar circuit (slc)
\\ 表面层合电路板 \\
+hole location \\孔位 \\
+hole density \\孔密度 \\
+hole pattern \\孔图 \\
+drill drawing
\\钻孔图 \\
+assembly drawing \\装配图 \\
+multi-layered film substrate(mfs) \\ 多层膜基板 \\
+alivh multilayer printed board \\ 层间全内导通多层印制板 \\
+chip on board (cob) \\ 载芯片板 \\
+buried resistance board \\ 埋电阻板 \\
+mother board
\\ 母板 \\
+daughter board \\ 子板 \\
+backplane \\ 背板 \\
+bare board \\ 裸板 \\
+copper-invar-copper board \\ 键盘板夹心板 \\
+dynamic flex board \\ 动态挠性板 \\
+static flex board \\ 静态挠性板 \\
+break-away planel \\ 可断拼板 \\
+flexible flat cable (ffc) \\ 挠性扁平电缆 \\
+membrane switch \\ 薄膜开关 \\
+hybrid circuit \\ 混合电路 \\
+thick film \\ 厚膜 \\
+thick film circuit \\ 厚膜电路 \\
+thin film
\\ 薄膜 \\
+thin film hybrid circuit \\ 薄膜混合电路 \\
+conductor trace line \\ 导线 \\
+flush conductor \\ 齐平导线 \\
+transmission line \\ 传输线 \\
+crossover \\ 跨交 \\
+edge-board contact \\ 板边插头
\\
+real estate \\ 基板面 \\
+conductor side \\ 导线面 \\
+component side \\ 元件面 \\
+solder side \\ 焊接面 \\
+conductive pattern \\ 导电图形 \\
+non-conductive pattern \\ 非导电图形 \\